| 制造工艺 | 模具成型，机械加工。 材料：不锈钢, 铝合金及工程塑料 | ||
| 应用领域 | 订购指南 | ||
| 需要提供的信息 | 表面处理 | 可选项 | |
| 产线周转晶圆，适用以下工序： 背面减薄 晶圆切割 装片 晶圆运输 | 设备型号及生产厂家 晶圆尺寸及封装形式。 | 电抛光 镜面抛光 电镀 | 激光刻字。 接受定制。 |
| Manufacturing process | Molding and Machining Material : Stainless Steel , Aluminum & Plastic | ||
| Application | How to order | ||
| Data input | Surface treatment | Option | |
| Use for handling wafer in the process of Back grinding Wafer sawing Die attach Inline process handling Shipping | The machine maker and machine model; Package description; Wafer size. | Fine polishing Electric polishing Nickel plating Anodize for AL | Thickness can be 1.2mm or 1.5mm. Custom marking Custom machining Custom design Recessed Barcode pad |
